Fabrication of micro- and nanostructures
Overall Course Objectives
Devices and sub-systems fabricated using nano- and microfabrication techniques are used in an increasing number of modern products ranging from airbag sensors for cars to the processor in computers. The functionality of these products is critically dependent on the micro and nano devices.
The overall aim of the course is to enable you to select relevant processes and to design a fabrication process for silicon based micro- and nanofabrication using the methods available in for example the DTU cleanroom DANCHIP and in commercial cleanrooms.
See course description in Danish
Learning Objectives
- explain the principles behind the basic lithographic processes (including UV lithography, e-beam lithography and nanoimprint lithography), field of use and limitations.
- explain the basic principles behind the processes used for planar processing (including diffusion, metallisation and wet and dry etching).
- calculate relevant process parameters (e.g. time, temperature or pressure) based on the underlying theory (e.g thermal oxidation of silicon, ion implantation, diffusion, electron scattering and interaction between radiation and matter).
- specify detailed process recipes for fabrication of micro- and nanosystems.
- select the most suitable process technology for a given task based on technical and economical considerations.
- use the ATHENA process simulator to predict the result of and optimise a silicon based fabrication process.
- explain technical and fundamental limitations for the fabrication processes used.
- use the kinetic gas theory to calculate process parameters (e.g. flux of molecules, mean free paths).
- use English to communicate and discuss the course content.
Course Content
In the course the physics, chemistry, and technology of the fabrication processes used is described:
·Lithography: UV-microlithography, e-beam nanolithography, and nano-imprint
·Pattern-transfer: etching, lift-off
·Thin film processes: CVD, PVD, spin-on
·Substrate-materials: Silicon and Silica
·Material modification: Ion-implant and doping-diffusion, annealing
·Bonding: anodic bonding, fusion bonding
·Process integration
·Process simulation
You will learn to use a modern process simulator (ATHENA – http://www.silvaco.com) which will allow you to perform advanced computation.
In the final part of the course you work in teams on making a process flow for a device that the team can freely choose. The process is then presented orally for all students.
Teaching Method
Lectures, e-learning and exercises, 4 hours a week. During the semester there are three home assignments. In the final part of the course there is a project which is presented at a scientific mini conference and finally there is a written exam.