Single-Course English 5 ECTS

Advanced micro- and nanofabrication technology

Overall Course Objectives

To teach you to use and evaluate available processes for fabrication of integrated circuits and semiconductor devices and understand the equipment and the methods used in fabrication. Based on this knowledge, make detailed process descriptions for the fabrication of integrated circuits, semiconductor devices, and Microsystems and evaluate the results of the processing and understand the connection between the physical models used and the fabrication procedure used.

Learning Objectives

  • Use analytical – linear or nonlinear – modelling for a first optimization iteration of a process sequence development and use analytical modelling to assist interpretation of numerical modelling results
  • Account for the fascinating interaction between diffusion, oxidation, and nitridation mediated by point defects, and predict the results of these effects on a fabrication process
  • Account for the fundamental physics of molecules and atoms in a vacuum chamber and the basic equipment used to produce and measure vacuum and for the use of DC- and RF-generated plasmas for deposition and etching
  • Account for how deposition process parameters affect film properties including step coverage and trench filling, and use this understanding to optimize deposition process parameters to meet target specifications if at all possible
  • Account for how etch process parameters affect the etch performance including selectivity and anisotropy and based on this tailor the etch parameters for target specifications
  • Account for how silicon crystal growth conditions affect the material parameters and interfere with further processing of the wafers, and based on this knowledge select the proper starting wafers for an application
  • Account in detail for the physics and photo-chemistry of UV lithography and be able to use this knowledge to optimize the lithography process even in the case of image reversal processing
  • Choose the proper doping method for a specified application and understand in detail the consequences of the choice in terms of thermal budget, defects, possible doping level, and control

Course Content

Physics and chemistry of semiconductor process technologies, including: Crystal growth, epitaxy, thin film technology, low pressure CVD, thermal oxidation, solid state diffusion, ion implantation, wet and dry etching, micro lithography, and electrical and physical evaluation of materials.

Recommended prerequisites

22600, Or equivalent courses

Teaching Method

One 4 hour session every week with lectures and problem solving.



The course can be taken as an extension of 22600.

See course in the course database.





13 weeks




DTU Lyngby Campus

Course code 10850
Course type Candidate
Semester start Week 5
Semester end Week 19
Days Fri 13-17

7.500,00 DKK